HTR3316
2.5V~5.5V电源供电。16个IO端口中的任何一个都可以配置为LED模式或GPIO模式。
2.5V~5.5V电压输电。16个IO网络端口中的所有一家都要以显卡设备为LED的的模式或GPIO的的模式。再者,所有GPIO都要以用单独显卡设备为设置或輸出。通电后,16个IO服务器端口设置性能正常为GPIO效果,正常情形可根据AD0和AD1来决定。各个性能为输进的IO服务器端口设置总要不间断监控摄像头情形改变,并享有8μs的防颤抖日期,IO口的改变由INTN效果显示灯。当GPIO情形根据I2C音频接口被导出时,INTN效果被清理掉。当IO表层硬件配置为LED策略时,也可以借助I2C标准接口将LED伺服驱动器器的电压直流电压放置在0~IMAX中间,并也可以以该值除于256步进驱动器行规则化调光。默认值最多电压直流电压(IMAX)为37mA,可在整体在管理寄存器中重设IMAX。HTR3316提供QFN4×4-24L封装。
价格:¥0.00 | 库存99999 |
数目:
|
特质
| 操作
|
引脚号 | 简称 | 功能性 |
1~4 | P1_0~P1_3 | GPIO mode default, input or output (push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.初始设备GPIO策略,输人或伤害(推挽架构),上电初始设备感觉由AD1和AD0确定。可设备为LED策略。 |
5~8 | P0_0~P0_3 | GPIO mode default, input or output (open-drain (default) or push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.正常GPIO传统策略,插入或输入输出(开漏型式(正常)或推挽型式),上电正常的情形由AD1和AD0定。可设置成为LED传统策略。 |
9 | GND | Ground. 地 |
10~13 | P0_4~P0_7 | GPIO mode default, input or output (open-drain (default) or push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.快捷设施GPIO,输人或导出(开漏的构成(快捷设施)或推挽的构成),上电快捷设施感觉由AD1和AD0决定的。可设施为LED玩法。 |
14~17 | P1_4~P1_7 | GPIO mode default, input or output (push-pull), the state after power on is decided by AD1 and AD0 terminals. Can be configured as LED mode.同意GPIO,录入或输出精度(推挽构造), ,上电同意传统模式由AD1和AD0打算。可设计为LED传统模式。 |
18 | AD0 | I2C device address, connect to VCC or GND,and control the default state of GPIOs (see table 1)。 I2C器件地址选择,接VCC或GND,并设置GPIO状态(见表1)。 |
19 | SCL | I2C serial clock. I2C时钟 |
20 | SDA | I2C serial data. I2C数据 |
21 | VCC | Power supply. 交流电源发送端. |
22 | INTN | Interrupt output pin, open-drain, need external pull-up resistor; active low.终断输入,开漏成分,需外界上拉电容;低有效的 |
23 | RSTN | Hardware reset pin, active low; internal 100 kΩ (typical) pull-down resistor.产品初始化,低为初始化;内麾下拉100 kΩ(举例值)功率电阻 |
24 | AD1 | I2C device address, connect to VCC or GND,and control the default state of GPIO (see table 1)。 I2C器件地址选择,接VCC或GND,并设置GPIO状态(见表1)。 |
EP | GND | Provides both electrical and thermal connection from the device to the board. Connect to the system ground. 保护接地。 |